Embedded Plasma Systems for Continuous, Scalable Operation
At TENGENA, we leverage proprietary environmental nanoplasmonic technologies to engineer a new class of plasma system devices designed for high-performance material synthesis, surface engineering, and energy recovery across diversified pressure regimes. Our platform moves beyond conventional thin-film deposition and surface modification, enabling advanced gas-phase, aerosol-phase, and liquid-phase plasma processing.
Through integrated Gas/Aerosol and Gas/Liquid Plasma Processing capabilities, we enable scalable production of engineered picocolloids, nanocolloids, and inorganic nanofluids with finely tuned physico-chemical properties. These materials are optimized for applications requiring extreme uniformity, high reactivity, and structural fidelity at quantum and sub-micron scales.
Our plasma systems support precision cleaning, conformal coating, directional etching, and substrate activation—critical for defect-free interfaces, enhanced adhesion, and surface energy modulation. These capabilities are foundational for EUV/DUV lithography preparation, quantum photonic IC packaging, spintronic and neuromorphic device integration, and heterogeneous substrate bonding.
Expanding into energy and resource recovery, TENGENA’s plasma architecture enables plasma-assisted gasification and plasma propulsion methods for oil well recovery and production. These systems are engineered to break down complex hydrocarbons in situ via high-energy plasma reactions, enhance extraction efficiency through directional energy flow and subsurface plasma pulsing, reduce reliance on chemical additives and thermal shock methods, and support modular deployment in remote or high-pressure environments.
By integrating plasma-driven energy conversion with nanomaterial synthesis, our infrastructure bridges quantum-scale fabrication with industrial-scale resource recovery—delivering precision, sustainability, and performance across sectors.
Low-pressure plasma systems operate within controlled vacuum environments and enable ultra-clean surface cleaning, substrate activation, directional etching, and conformal coating—all critical for precision surface engineering across advanced manufacturing domains.
Atmospheric pressure plasma systems offer a versatile, open-air solution for surface treatment and material activation without the need for vacuum infrastructure. Operating at ambient conditions, these systems enable direct integration into continuous production lines and modular manufacturing environments.
TENGENA’s individually tailored plasma systems are engineered for precision synthesis and scalable energy, customized to support high-yield nanomaterial generation, directional energy flow, and plasma-assisted conversion processes, including hydrogen production, solar–plasma hybridization, and in-situ gasification.

Plasma cleaning offers a highly precise method for removing nano-scale dust particles and surface contaminants, ensuring exceptional substrate purity. Through chemical-physical reactions occurring at the nanoscale, it produces high-quality, well-defined surfaces that are ideally suited for subsequent bonding, coating, varnishing, or printing processes. This advanced treatment enables the use of solvent-free or water-based systems, eliminating the need for chemical primers or mechanical pretreatments such as brushing.

Plasma pre-treatment offers a transformative approach to modifying the surface properties of non-polar plastics. When exposed to plasma, these materials undergo a chemical activation process in which oxygen- and nitrogen-containing functional groups are introduced into the substrate. This significantly increases the surface energy, resulting in enhanced activation and improved wettability. As a result, adhesives, paints, and lacquers adhere more effectively and with greater durability. The process eliminates the need for traditional flame treatments or environmentally harmful chemical primers.

Plasma technology enables the production of ultra-thin functional coatings on a wide range of surfaces. By introducing an organo-silicon compound into the plasma as a precursor, the system facilitates controlled deposition onto the substrate. This approach allows for the precise vaporization of liquid-phase additives at ambient temperature, delivered via carrier gas with high reproducibility. The result is the formation of tailored nanocoatings—both hydrophilic and, for the first time, hydrophobic—engineered for specific surface performance and downstream compatibility.

TENGENA’s Plasma Pulse Technology delivers a powerful, instantaneous discharge of super-ionized energy, generating a cascade of non-linear acoustic shock waves that propagate deep into the reservoir. This innovative approach transforms conventional well stimulation by leveraging modular coronal discharge and plasma-induced resonance to unlock trapped hydrocarbons, restore flow efficiency, and enhance monodispersion.
A plasma generator initiates the ionization of a metal filament, creating a coronal discharge that releases bursts of high-energy acoustic waves. These waves interact with the surrounding reservoir, energizing fluid molecules and stimulating the formation’s inherent resonant frequencies. High-frequency pulses focus on cleaning the near-wellbore region, removing skin damage and reopening perforations. Simultaneously, low-frequency waves propagate deeper into the reservoir, enhancing pore connectivity and reducing oil viscosity to facilitate improved hydrocarbon flow, offering:
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