Ag, Al, Au, Cu, Mo, Nb, Ni, Pt, Pd, Te, Ti, Re, Ru, Zn, W
CRITICAL MINERALS RANGE
MONODISPERSION &CONCENTRATION
MEDIA FORMATS & SCALABILITY
Deep capacity of advanced picoscale and nanoscale materials manufacture, particularly from noble, alloy, and compound metals.
MEDIA FORMATS & SCALABILITY
MONODISPERSION &CONCENTRATION
MEDIA FORMATS & SCALABILITY
Providing access to different scale material format including dispersions, colloids, and functional systems over organic and inorganic substrates.
MONODISPERSION &CONCENTRATION
MONODISPERSION &CONCENTRATION
MONODISPERSION &CONCENTRATION
Fabricating stable, monodispersed, and concentrated colloids in aqueous, inorganic, organic, and proprietary substrates.
INORGANIC METALLIC SUBNANO- AND NANOSCALE MATERIALS
TENGENA’s position is enabled by strategic competitive capability in:
- Customized manufacturing uses cutting-edge, batch-to-batch reproducible techniques with green technology advantages.
- Nanoplasmonic synthesis across aerosol and liquid interfaces, which eliminates entrainment of unnecessary chemical solvents and ensures flexibility in reducing agents as chemically-free and oxygen-free noble metal processing.
- Ultra-uniform spherical nanocolloids, ranging from pico- to nanoscale, formed by precisely controlled size (0.1–100 nm) for optimized applications.
- Scalable one-pot concentrated nanomaterials, exceeding 70 % OD, allowing smooth transitions from prototype development to high-volume production.
- Extended stability, maintaining structural integrity and functionality up to twelve-months shelf-life period when stored at 4°C and up to six-months shelf-life period when stored at 24°C.
- Innovative nanocoating solutions using self-assembling and solvent-driven spontaneous pico- and nanoscale architectures, further improving product stability and performance.
- Cost-effective and time-consuming synthesis with minimal/no purification or defect remediation needed due to the high monodispersed status.
Miniaturization-Driven Integration
TENGENA PICOMATERIALS Deposition Process Comparison
Advanced efficiency through enhanced density and ultra-miniaturization of assembly components at the atomic scale governs quantum confinement, interfacial chemistry, and lattice precision performance of charge transport, photonic coupling, thermal behavior, and defect dynamics.