Recognizing the environmental challenges, TENGENA advance fundamental research in nuclear and particle physics to gain a deeper understanding of matter, energy, and time. We apply quantum information science and artificial intelligence to transform technology and nanomaterials research to energy challenges that are critical towards a net-zero carbon economy. Our team redefines mobility, breaking down barriers, and shaping solutions, which carve the foundation of our product development.
TENGENA identifies the challenges in fundamental sciences and aims to advance discovery and innovation across the nanotechnology research and development enterprise. Using advanced nanoplasmonic technology, our team designed and implemented novel plasma system devices that are relatively efficient, productive, and reproducible. Our portfolio encompasses efforts along with an ever-growing list of applications that includes nanomedicine, nanoelectronics, water treatment, and energy generation and storage. Being concerned about the natural resources in the world, we think that the financial standing of our technologies is clearer and more affordable.
TENGENA facilitates research and development into nanotechnologies for creating highly configurable industrial applications, employing low-pressure gas plasma surface processing. The main system components of plasma technology, nozzles, process controls, and generators, allow to fully exploit consistently high quality and reproducibility of plasma surface activation, including enhancing adhesion and applying protective coating. Whether attempting to improve adhesion of dissimilar materials, enhancing surface wettability or functional coating that repels biological fluids, plasma surface treatments add a significant value to biotechnology and many clinical applications.
TENGENA aims to equip manufacturers with control and repeatable surface engineering and modification processing over the low-pressure plasma etching technology. Our team focuses on the development of non-corrosive oxygen plasma treatment for organic, inorganic, and polymeric materials. We empower the application of oxygen, argon, hydrogen plasma to process semiconductors in the etching devices, cleaning and activation of wafers and cell phone components, photoresist removal, oxide reduction of bond pads, and microfine cleaning of flexible electronics. Compare to chemical etching that uses hazard materials, plasma technology is safe.
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